Cooler Master IceFusion 200 g Thermal Paste
Cooler Master IceFusion 200 g Thermal Paste
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Specifications
ManufacturerCooler Master
ModelIceFusion
Part #RG-ICFN-200G-B1
Amount200 g
Features

System builder value size contains enough compound for 500 applications

Resealable package

High thermal conductivity.

Low thermal resistance.

Non-corrosive.

Best thermal stability in high temperature.

Excellent adhesion.

Preserve in room temperature for longer lifespan.

Color: White

Specific Gravity @ 25°C: >2.5

Dielectric Constant: >5.1 at 100Hz

Dissipation Factor: <0.005 at 100Hz

Temperature Stability (°C): -50 ~ 24°C

Thermal Conductivity (W/m-K): >1.22

Net Weight: 200 grams / 0.44lbs